| 摘要 |
<p>PURPOSE:To prevent short-circuiting between neighboring heads and to achieve a high-density packaging by placing each long and short leads of external leads alternately for placing each tip part in a plane zigzag shape. CONSTITUTION:A semiconductor device 1 is placed on an insulating substrate 11, tip parts 3a and 3b of each external lead 3 are positioned to land parts 12a and 12b of each wiring pattern. and electrical and mechanical connections are made by solder or a conductive adhesive 14. Then, the tip parts 3a and 3b of the external leads 3 are placed in a plane zigzag shape and the gap between each tip parts 3a and 3b and that between each land 12a and 12b of a wiring pattern 12 are made larger, thus preventing solder from being extended between the neighboring leads and lands and preventing short-circuiting between leads.</p> |
