| 摘要 |
PURPOSE:To reduce lead time and cost, and improve reliability, by constituting the connection pattern part of semiconductor on a circuit board so as to protrude from the other connecting pattern part, spreading adhesive agent on the circuit board for mounting semiconductor, and heating it while ultrasonic wave pressure is applied from above and below. CONSTITUTION:A protruding pattern part 4 and a semiconductor electrode part 6 generate intermetallic compound by ultrasonic pressure, and a pattern 2 and semiconductor 5 obtain electric continuity. As the result of pressurizing, adhesive agent 7 flows out toward the bond outer periphery of the circuit board 1 and the semiconductor 5, and covers an active surface of the semiconductor 5. As the result of heating, the adhesive agent 7 is hardened. By the hardening of the adhesive agent, the circuit board 1 and the semiconductor 5 are mechanically fixed. As the result that the adhesive agent 7 which has flown out toward the bond outer periphery of the semiconductor 6 covers the active surface of the semiconductor 5, said semiconductor can be protected from the stress from the outside and the change of environment. Thereby the structure and constitution components are simplified, so that processing lead time and cost are reduced, and reliability is improved. |
