发明名称 METHOD FOR MOLDING SMC MOLDED PRODUCT, LAMINATED SHEET AND PRINTED WIRING BOARD
摘要 PURPOSE:To eliminate air bubbles and thin spots, to improve capacity and appearance and to perform molding within a short time by superposing a plurality of prepregs on a male mold and fitting a female mold in the male mold to preheat both molds and, thereafter, applying vibration to said molds under heating and pressure or under heating, pressure and reduced pressure to form a molded product. CONSTITUTION:SMC prepregs 6 each formed by impregnating a glass fiber chop base material with a polyester resin and bringing the impregnated one to a semicured state are heated, pressed and depressurized using a press machine 1 equipped with male and female molds 7 having a depressurizing apparatus 3 and a vibration apparatus 4 and vibration is applied to the molds to perform molding. As a result, a molding time is shortened to a large extent and a pinhole and thin spots such as gloss difference and surface sink caused by the non-uniform flow of a resin at the time of molding are reduced and a molded product having good capacity and appearance is obtained.
申请公布号 JPH0324919(A) 申请公布日期 1991.02.01
申请号 JP19890160533 申请日期 1989.06.22
申请人 HITACHI CHEM CO LTD 发明人 MATSUFUJI KENJI;SHINKAI MAKOTO
分类号 C08J5/24;B29C43/02;B29C43/20;B29K105/06;H05K3/02 主分类号 C08J5/24
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