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发明名称
摘要
In a lead frame for a semiconductor device, inner leads are formed by etching and outer leads are formed by pressing.
申请公布号
JPH036663(B2)
申请公布日期
1991.01.30
申请号
JP19850254330
申请日期
1985.11.13
申请人
MITSUI HIGH TEC
发明人
FUJITA KATSUFUSA
分类号
H01L23/50;H01L21/48
主分类号
H01L23/50
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