发明名称 RESIN SEAL MOLDING METHOD AND ITS MOLD FOR ELECTRONIC PARTS
摘要 PURPOSE:To improve the quality of product by improving the whole productivity, by a method wherein a ground flaw part, which is in the direction meeting at right angles with a continuous direction of a flaw on the surface of a lead, is formed on the fringe parts of cavities of both molds joined to a surface part of the lead, the surface of the lead and a parting line between both the molds are pressure-contacted and a molten resin material is cast within the cavity. CONSTITUTION:Ground flaw parts 16, 17 of fixed directions are formed respectively on the fringe parts of both a top and bottom cavities 14, 15. In addition, the fixed direction means one meeting at right angles with a continuous direction of a flaw formed in a longitudinal direction of a lead 3 in a lead frame 18. Then the ground flaw parts 16, 17 are formed at least on the fringe parts of both the cavities joined to a surface part of the lead 3. A lead frame 18 fitted with electronic parts 13 is set up to a fixed position of a parting line P, L of a bottom force 11, mold clamping of both the forces 11, 12 is performed and a molten resin material is cast into both the cavities 14, 15 with pressurization. After the lapse of a necessary curing period of time, both the forces 11, 12 are broken again and a resin seal molded body is obtained.
申请公布号 JPH0321413(A) 申请公布日期 1991.01.30
申请号 JP19900129383 申请日期 1990.05.18
申请人 T & K INTERNATL KENKYUSHO:KK 发明人 OSADA MICHIO
分类号 F16J15/14;B29C45/02;B29C45/14;B29C45/17;B29K105/22;B29L31/34;H01L21/56 主分类号 F16J15/14
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