| 摘要 |
PURPOSE:To make short wires in case electrodes on the other main surface of a semiconductor chip or the adhered body of two semiconductor chips are led out through the wires and a lead frame and to contrive the prevention of generation of an improper short-circuit by a method wherein a lead-out of electrodes on the main surface of at least one side of the chip or the adhered body is performed through bumps. CONSTITUTION:Electrodes on the main surface 2b of a semiconductor chip 1 and a wiring film 5 on a substrate 4 are connected to each other through bumps 3 consisting of a conductive material like solder, gold or lead. The substrate 4 consists of ceramic or an organic material, the wiring film 5 is formed on both main surfaces of the substrate 4 and both main surfaces of the substrate are connected to each other through through holes 6. The upper faces of the inner ends of parts extended to the horizontal direction of leads 8 and 8 are connected to the film 5 on the rear of the substrate 4 through a conductive bonding agent. Leads 9 and 9 are connected to electrodes on the main surface 2a of the chip 1 through connecting wires 10 and the heights of the leads are set in a height in a degree only a little lower than that of the main surface 2a of the chip 1. The lengths of the wires 10 become very short.
|
