| 摘要 |
<p>PURPOSE:To enable the components of a hybrid integrated circuit of this design to be mounted on both the sides of a mother board so as to make the integrated circuit high in density and degree of integration and small in size by a method wherein the leads of the components of a multilayered hybrid integrated circuit that a thin film circuit and a thick film circuit are mixedly provided are formed into a pinless grid array pad. CONSTITUTION:A through-hole 8 is provided alumina boards 121-124 respectively, and a conductor pattern is printed thereon, and the boards 121-124 are laminated to form a thick film multilayer board 12 through a lamination connection technique, a thin film multilayered board 13 is formed thereon through a thin film circuit technique, and a wire-bonded hybrid chip component 2 such as a VLSI or the like and another chip component 21 are mounted to constitute a multilayer hybrid integrated circuit that a thin film circuit and a thick film circuit are mixedly provided. Moreover, the components are primarily sealed off with epoxy resins 71 and 72 and then furthermore secondarily sealed off with an epoxy resin 7. Pinless grid pads 6 are provided to the rear side of the thick film multilayer board 12. Besides a wiring, a resistor, capacitor, if necessary, elements such as diodes and transistors can be formed on the thin film multilayer board 13 and the thick film multilayer board 12.</p> |
