发明名称
摘要 PURPOSE:To prevent influence of contraction of header on sleeve during cooling process after the bonding, by making small the contact area between at least one header of both electrodes of diode to be inserted into a glass sleeve and the sleeve end surface. CONSTITUTION:The tapered portion 9 linearly inclinded to the side of lead wire 2 is respectively provided to the inside of headers 1 of both electrodes 3, 4 to be inserted into a sleeve 12, and the sleeve 12 itself is cut short thereby leaving a predetermined interval 10 to the tapered portion of the upper header 1. The tapered portion 9 is shaped in almost truncated cone and its end is integrated to the lead wire 2. As the sleeve 12, the SiO2-PbO2-K2O glass having the thermal expansion coefficient of about 91X10<-7>/ deg.C can be used, while as the electrodes 3, 4 a Cu clad Fe-Ni can be employed. On the occasion of assembling, the lead wires 2 are inserted so that th pellet 13 can be mounted within the sleeve 12. Thereafter, the contact area of sleeve 12 and lead wire 2 is bonded to each other.
申请公布号 JPH036662(B2) 申请公布日期 1991.01.30
申请号 JP19810209255 申请日期 1981.12.25
申请人 HITACHI LTD 发明人 SAITO TOSHINAO;YAMADA KOHEI;TERAKADO HAJIME;IKEDA YASUHIKO
分类号 H01C1/02;H01G4/224;H01L23/051;H01L23/08 主分类号 H01C1/02
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