| 摘要 |
PURPOSE: To improve the mechanical and electric performance by connecting at least one of lead frame conductors to the other one of the lead frame conductors through wires connecting one conductor to another. CONSTITUTION: A chip 14 supports a large number of conductor lead frame conductors 15 in which leads or conductors 18 are electrically connected by bonding wires 16 to respective terminals 17 on the semiconductor chip 14 surface. While encapsulating with a material 19, the conductors 18 are supported as units by lead frame bars 20. After encapsulating, the material 19 is hardened and lead frame bars 20 are removed. Inner parts of the conductors 18 extending to above the chip 14 are separated from the semiconductor chip 14 surface by inserts 22 serving as an insulator and/or alpha particle barrier. This minimizes the wire 16 length and improves the mechanical and electric performance. |
