HYBRID INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To make smaller devices by making a plurality of conductive paths connecting a microcomputer and a memory chip independent of both said microcomputer and memory chip and extended along a side of a substrate. CONSTITUTION:An EPROM chip 4 is connected to conductive paths 3 on a substrate 2 and to an adjacent conductive path 3 with a wire; therefore, said EPROM chip 4 can be placed at an arbitrary position. So the EPROM 4 and a built-in microcomputer 5 can be connected efficiently to make the best electric connection thereof, requiring no signal line, or wiring laid around the conductive paths 3. The microcomputer 5 related closest can be arranged next the EPROM chip 4, a data line for data exchange between the EPROM chip 4 and the microcomputer 5 can be shortened to the utmost, and loss of the packaging density by connecting the data line around can be minimized. Thereby high-density packaging becomes possible and smaller devices can be manufactured.