| 摘要 |
PURPOSE:To make it possible to bore a through hole on each insulation layer, if a kind of insulation layer mask is provided, by installing a land pattern, a through hole pattern, a first and second masks. CONSTITUTION:A land pattern 22, which is provided in a circuit layout mask in a part corresponding to a specified point 23 where an interconnection layer is connected, is installed to an insulation mask. Moreover, a through hole pattern 17 is provided in a insulation mask at a part corresponding to the specified point 16 where at least two interconnection layers are connected. Further, at least one first mark 25 provided based on a positioning reference point on a plurality of interconnection layer masks are installed to the insulation layer mask. In addition, second marks 19a to 19d are installed there, which allow a through hole pattern 17 to be deviated as specified in a different direction, centering on a specified point 15 when they are arranged to meet the first mark 25 for the plurality of interconnection layer masks. This construction makes it possible to bore a through hole in each insulation layer, if a kind of insulation layer mask is provided. |
