METHOD OF BONDING LIQUID CRYSTAL DEVICE

摘要

PURPOSE:To simplify the process and to improve the yield rate of a liquid crystal device by vibrating an aluminum wire with ultrasonics while pressing it with a tool so as to bond the aluminum wire with an ITO wiring film. CONSTITUTION:In the method of connecting a wire with the wiring film 2 of an indium tin oxide(ITO) formed on a glass board 1, an aluminum wire 6 is vibrated with ultrasonics while pressing it with a tool 8 so as to bond the aluminum wire with the wiring film 2. Accordingly, there is no necessity of forming a special aluminum film to take electrical contact with the ITO wiring film 2. Hereby, the process is simplified, and also defect following it vanishes.