| 摘要 |
<p>PURPOSE:To prevent a curvature from occurring at a substrate by the mounting of semiconductor devices and to improve mounting density by attaching the semiconductor devices to the opposing positions on both sides of the substrate, respectively, and sealing them with resin so as to unite them with the substrate. CONSTITUTION:Required numbers of semiconductor devices are attached to one side of a substrate 20, and next the substrate 20 is rotated 180 deg., and then semiconductor devices are attached, being opposed to the semiconductor devices D, to the other side. Next, each semiconductor device D attached to both sides is sealed with resin, and both sides are heated at the same time, and they are hardened and united with the substrate 20. Hereby, the hardening shrinkage of the resin is offset, and the substrate 20 ceases to curve to one side, and the semiconductor devices D are attached to both sides of the substrate 20, so the mounting density can be improved.</p> |
