| 摘要 |
In a method of manufacturing semiconductor devices employing a trench isolation method in which trenches of different depth are formed in a silicon body and insulating materials are filled in these trenches, there is described the manufacturing method having a step of forming a first depth trench, filling with a first insulating material in the first depth trench, forming a second depth trench, which is formed relatively shallow and adjoins at least a part of the first trench and filling with a second insulating material in the second depth trench.
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