发明名称 TRANSMISSION MEDIUM INSERT-MOLDED CIRCUIT STRUCTURE
摘要 PURPOSE:To obtain a structure which serves as both a conductor circuit and a case by a method wherein a conductor circuit module and a transmission medium are insert-molded in an electronic electric equipment, where the conductor circuit module is formed in such a manner that an electrical.optical medium is monolithically formed in synthetic resin. CONSTITUTION:A structure of this design is formed in such a manner that an optical, an electric signal, and a power energy transmission medium are insert-molded in synthetic resin, where optical fibers are used for optical signals as the transmission medium, electric wires or a metal thin plate lead frame is used for electrical signals, and an electric power line or a metal conductor circuit of two-dimensional or three- dimensional structure elliptic in cross section is used for power energy. The molding of the structure is carried out in such a way that a three-dimensional transmission medium is installed inside a mold, the transmission medium is partially or all fixed by molding or insulated by coating through a transfer molding of low pressure, and then a cavity is expanded and resin excellent in heat resistance is injection-molded, whereby a conductor circuit module 6 and a case 7 are formed into a integral structure. Usually, epoxy resin containing quartz powder is used for a transfer molding, and polyphenilene sulfide or the like whose thermal deformation temperature is 200 deg.C or above is used for an injection molding.
申请公布号 JPH0319396(A) 申请公布日期 1991.01.28
申请号 JP19890152316 申请日期 1989.06.16
申请人 HITACHI LTD 发明人 GOTO MASAO;IIDA MAKOTO;WARATANI KENICHI;YANOKURA YONEZO;SATO MASAKI
分类号 H05K7/06;B29C45/14;B29L31/34;H05K1/00;H05K1/02;H05K3/00;H05K3/20;H05K7/14 主分类号 H05K7/06
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