| 摘要 |
<p>PURPOSE:To prevent connection failure from occurring between a thick film wiring board and a thin film circuit due to the variation of the thick film wiring board in shrinkage factor by a method wherein a connection conductor pattern is formed taking a position, where the pattern is connected with the thin film circuit formed above it, into consideration. CONSTITUTION:A positioning mark 15 is printed on the surface of a ceramic thick film wiring board 10 formed of an aluminum board 11 and an inner conductors 12 provided inside the board 10. Vias 13 are provided inside the board 10, conductor pads 16 connected to the exposed vias 13 are formed in ellipse or belt 50-500wmu wide on the surface to serve as a layer 62 matching with wiring conductors 22 inside a thin film wiring board 20 and the board 10. The conductor pad 16 is formed as follows: the position of the positioning mark 15 is detected by pattern recognition through an electron beam or an optical image; then a metal film is formed taking the variation of the board in shrinkage factor into consideration; negative type photoresist is applied thereon; the deviation of the detected position from a prescribed position is obtained; the photoresist is so patterned as to enable the pad 16 to be electrically connected with a thin film circuit which is to be formed; the patterned photoresist is irradiated with an electron beam and developed; and the metal film is etched and thermally treated. An LSI 30 is connected to the thin film circuit through the intermediary of a pad 23 provided to the top of the circuit.</p> |
