| 摘要 |
PURPOSE:To make it possible to alignment conduct accurately in the manufacturing process by a method wherein an electron beam is made to irradiate on a wafer, and the positioning of wafer is conducted based on the electric signal obtained by detecting the X-rays emitted from a marking part. CONSTITUTION:A first layer of electrode/wiring 3E and a first layer of metal marking part 3M are formed. Then, a second layer of Al electrode/wiring film 5 is formed. A second layer of electrode/wiring and a second layer of metal marking part are formed by patterning the above-mentioned film 5. When an electron beam EB, emitted from an electron gun EG, is projected on the marking part of a wafer WF, X-rays XL are generated on the marking part, they are received by an X-ray detector DT and converted into an electric signal, the signal is amplified by an amplifier AR, and the relation between position and signalstrength is computed by an arithmetic unit LG. Through the above- mentioned procedures, the above-mentioned signal can be obtained from the arithmetic unit LG, and as a result, an alignment operation can be conducted utilizing said signal. |
