| 摘要 |
PURPOSE:To minimize the passages of electric source wiring system or grounding wiring system passing through a substrate and improve heat radiation properties by a method wherein at least some of the external connection terminals of the wiring system are provided in the part corresponding to the upper or lower part of a semiconductor element. CONSTITUTION:Electric source wirings or grounding wirings are connected to conductive layers pads 11 which are provided near a semiconductor element 1 and between external connection terminals 13 arranged periodically on the rear of a package and connected to an expanded conductive solid layer 12 provided in an insulating base substrate 7. The electric source wirings or the grounding wirings are expanded to the width direction of the substrate by the expanded conductive solid layer. By connecting the electric source wirings or the grounding wirings in this way, the area of the wiring regions can be reduced and the size of the package can be reduced and, further, the wiring lengths can be reduced, so that inductive components and wiring resistances can be suppressed. With this constitution, the inductive components can be reduced, the delay of a signal propagation time can be reduced and, further, a heat radiation path can be shortened, so that the heat radiation properties of the package can be improved. |
