| 摘要 |
<p>PURPOSE:To realize a high-density mounting operation in a state that a cost for an installation has been lowered by a method wherein an LSI chip is connected to a circuit board by using only a light-hardening insulating resin. CONSTITUTION:An LSI chip 26 which is provided with bumps 27 at electrodes is set facedown and is fixed and bonded to a wiring board 29 by using a UV resin 29 of a light-hardening insulating resin; the bumps 27 of the LSI chip 26 and conductor interconnections 30 of the wiring board 29 are connected by a pressure-bonding operation while the light-hardening resin is being contracted. In this manner, a series of mounting processes of the LSI chip 26 onto the wiring board 29 such as a coating operation of the UV resin 28 on the LSI chip 26, an alignment operation of the LSI chip 26 with the circuit board, a pressurization operation onto the LSI chip 26 and a hardening operation of the UV resin 28 can be executed by using one apparatus so as to satisfactorily comply with a change in the chip and by reducing a connection defect; a heating mechanism and an ultrasonic mechanism are not provided. Thereby, the LSI of high pin counts and fine pitches can be bonded collectively at a low installation cost.</p> |
