| 摘要 |
PURPOSE:To improve the heat radiation efficiency of a semiconductor device by a method wherein heat generated in semiconductor pellets is discharged into a mounting board through respective heat radiating bonding pads and heat radiating leads. CONSTITUTION:A semiconductor storage device 100 is composed of a plurality of semiconductor pellets 102. A plurality of heat radiating bonding pads 104 are provided on the element forming surface of each semiconductor pellet 104. The inner lead of a heat radiating lead 106 is connected to each heat radiating bonding pad 104 with a bonding wire 107. The respective bonding pads 104 and the respective heat radiating leads 106 are so arranged as to correspond to each other and connected to each other with the bonding wires 107 respectively. The outer leads of the heat radiating leads 106 protrude outside a resin- sealed part 109 and are connected to the mounting surface of a mounting board 110. With this constitution, the heat radiation efficiency of the semiconductor device positioned in the innermost or central layer can be improved. |
