| 摘要 |
PURPOSE:To prevent foreign substances from being caught between outer leads and the side surfaces of a resin-sealed package and avoid short-circuit defects by a method wherein the side surfaces of the package is inclined with a relatively large angle to form retreated parts. CONSTITUTION:As the side surfaces 8a of a resin-sealed package 8 are inclined with a relatively large angle theta to form retreated parts 9, minimum necessary gaps S can be formed between the side surfaces 8a of the package 8 and outer leads 6 over the whole vertical direction. The gaps S can be properly maintained even if there is an error in setting a lead frame 10 in the cavity 23 of a transfer molder and even if there is an error in a bending process of J-leads. With this constitution, appearance defects related to the gaps between the J-leads and the package side surfaces and short-circuit defects can be avoided. |
