发明名称 CONDUCTIVE PASTE FOR MULTILAYER CIRCUIT BOARD AND MANUFACTURE OF MULTILAYER CIRCUIT BOARD
摘要 PURPOSE:To improve soldering wettability of a conductor by dispersing magnesium organic acid salt by metal oxide conversion to copper powder and barium organic acid salt by oxide conversion at specific ratios in organic vehicle. CONSTITUTION:0.4-1.0 pts.wt. of one or more types of magnesium organic acid salts by metal oxide conversion to 100 pts.wt. of copper powder, and 0.8-3.8 pts.wt. of one or more types of barium organic acid salts by metal oxide conversion are dispersed in organic vehicle. The copper powder used for conductive paste means not only copper metal powder but copper oxide powder, copper powder covered on the surface with copper oxide, and mixtures thereof. Thus, diffusion of conductor metal to a board is suppressed to a minimum limit, and solder wettability of a conductor in the case of forming on the surface of the board is improved.
申请公布号 JPH0316197(A) 申请公布日期 1991.01.24
申请号 JP19890149543 申请日期 1989.06.14
申请人 SHOEI CHEM IND CO 发明人 ASADA EIICHI;ARAI NORIO;ENDO TAKASHI;UCHIDA TOMOKO
分类号 H05K3/46;H05K1/09 主分类号 H05K3/46
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