| 摘要 |
A surface mounting device (10) incorporating a high power RF semiconductor transistor comprises a common lead plane (12), an input lead plane (14), a collector lead plane (16), a transistor die (20) electrically and thermally connected to the collector lead plane (16), bonding wires (26,26 min ) for connecting emitters (24) and bases (22) of the transistor (20) to the common (12) and input (14) lead planes respectively, and a molded plastic body member (28) for sealing the device components (70) while leaving the lower coplanar surfaces of the lead planes exposed on the bottom face of the device (11). There are no flying leads. By eliminating an expensive metallized ceramic insulator from inside the device package (10) and instead providing electrical isolation as a part of an external circuit board (30), the cost for fabricating the device and installing them on the printed circuit board (30) are significantly reduced. The device is particularly rugged and can be easily mounted on the PC board (30) by automated equipment. |
