| 摘要 |
The semiconductor mould for producing highly precise lead frames prevents the deformation caused by the thermal expansion of the mould parts of which materials are different from one another and the leakage of the melt resin flowing between the mould parts. The mould comprises a cavity block (2), a chase, and a mould baser (8). The dowel pins (4,4') are installed at both ends of the lengthwise lower chase so that the mould center is kept constant. A stopper block (7) having higher thermal expansion coefficient than the lower chase is installed at one side of the lower chase so that the shift of the cavity block and the lower chase caused by the thermal expansion is prevented. Also the left and right end keys (5,6) are installed at the gap between the lower chase and the center block (9), and at one side of the chase, to prevent the leakage of the melt resin.
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