| 摘要 |
<p>A method for forming a bump (27) by bonding a ball on an electrode (26) of an electronic device (25) comprises the steps of forming a ball (21a) at a bottom end of a metallic wire (21) held by a capillary (20) by discharging between the metallic wire and a discharge electrode (22), fixing the ball on an electrode (26) of an electronic device (25), and cutting the metallic wire to form a bump on the electrode, wherein the ball (21a) is formed just under the capillary to touch the bottom end of the capillary. The heat transfers from the ball to the capillary and the metallic wire inside the capillary does not recrystallize, so that the interface of recrystallization is positioned just above the ball, where endurance against the shearing stress is weak. As a result, the metallic wire is cut just above the ball, and a bump with no wire-shaped part is formed.</p> |
