| 发明名称 |
IMPROVED STORAGE LIFE OF PB-IN-AG SOLDER FOIL BY SN ADDITION |
| 摘要 |
<p>A lead based, tin free alloy is modified by adding thereto about 0.5 to 4 weight percent of tin. The alloy is rapidly solidified by forming a melt thereof containing the tin addition and quenching the melt on a moving chill surface at a quenching rate of at least about 105 DEG C./sec. Addition of the tin inhibits formation of lead oxide film in the rapidly solidified alloy and substantially increases the storage life thereof.</p> |
| 申请公布号 |
EP0224068(B1) |
申请公布日期 |
1991.01.23 |
| 申请号 |
EP19860115075 |
申请日期 |
1986.10.30 |
| 申请人 |
ALLIED-SIGNAL INC. (A DELAWARE CORPORATION) |
发明人 |
BOSE, DEBASIS;LIEBERMANN, HOWARD HORST |
| 分类号 |
B23K35/14;B23K35/26;B23K35/40;C22C11/00;C22C45/00;H05K3/34 |
主分类号 |
B23K35/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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