发明名称 Spacer tape for IC package.
摘要 <p>A spacer suited to be rolled together with a film carrier having a multiplicity of longitudinally arrayed wiring patterns in a central portion thereof for the prevention of direct contact between adjacent layers of the rolled film carrier is disclosed, which includes a flexible, continuous tape (1) formed of a synthetic resin, and a pair (4,5,6,7) of parallel, longitudinally arranged rows of protrusions formed on each of the abverse and reverse sides (2,3) of the tape. The paired rows of protrusions are transversely spaced apart from each other at a distance greater than the width of the wiring patterns of the film carrier but not greater than the width of the film carrier.</p>
申请公布号 EP0409391(A2) 申请公布日期 1991.01.23
申请号 EP19900305879 申请日期 1990.05.30
申请人 SOMAR CORPORATION 发明人 KOBAYASHI, AKIRA
分类号 H01L23/14;H01L23/498 主分类号 H01L23/14
代理机构 代理人
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