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发明名称
Semiconductor pressure sensor and method for bonding semiconductor chip to metal diaphragm thereof
摘要
申请公布号
US4986861(A)
申请公布日期
1991.01.22
申请号
US19890322561
申请日期
1989.03.13
申请人
NIPPON SOKEN, INC.
发明人
NISHIDA, MINORU;MIZUNO, NAOHITO;HATTORI, TADASHI;HUZINO, SEIZI;ANDO, YOSHIYASU
分类号
H01L29/84;G01L9/00;G01L9/04
主分类号
H01L29/84
代理机构
代理人
主权项
地址
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