| 摘要 |
<p>PURPOSE:To eliminate the contamination of a semiconductor wafer in other process caused by the attaching of a metal film of the rear of the semiconductor wafer, and enable the loading and the unloading of semiconductor wafer on and from a pallet by belt conveying, by constituting the pallet on which a plurality of semiconductor wafer are mounted in two-layer structure. CONSTITUTION:In a semiconductor wafer processing apparatus which mounts a plurality of semiconductor wafers on a pallet and processes them en bloc, the pallet is constituted in a two-layer structure wherein the pallet is moved up and down via a guide bar 4. The lower pallet 1 is provided with the following; a semiconductor wafer mounting part 1a, penetrating holes 1b through which conveying mechanism 6a, 6b for conveying the semiconductor wafers 3 on the mounting part 1a can come and go, and penetrating holes 1c through which stopping bars 7a, 7b for stopping the conveyed semiconductor wafers 3 can come and go. The upper pallet 2 is provided with penetrating holes 2b for covering the periphery of the mounted semiconductor wafers 3, which holes are a little smaller than the diameter of the semiconductor wafer 3. The above two-layer structure pallet performs wafer processing, while the semiconductor wafers 3 are sandwiched by the upper and the lower pallets 2, 1.</p> |
