| 摘要 |
<p>PURPOSE:To suppress a solder amount to be used to a small amount, and to manufacture a multilayered high-density module which is strong against a thermal impact without variation in a capacity upon damage of the electrodes of a ceramic chip capacitor by holding mounting electrodes of the capacitor on the some surface as a circuit mounting land, filling resin, securing the capacitor and then adhering it by soldering. CONSTITUTION:A temporarily securing film 10 such as a polyester film, etc., having an adhesive layer of silicone resin is plated to the mounting surface 1, of a first layer substrate 1 having an engaging hole 4 and a component mounting land 3. Thereafter, a ceramic chip capacitor 5 is inserted into the hole 4, adhered to the film 10 to be fixed, filling epoxy resin 9 is poured, and solidified. Then, the film 10 is peeled. Thus, the surface 1, is constructed to have only one faces of an external electrode 7 for mounting the land 3 and the capacitor 5 of the substrate on the surface. Solder cream is printed only on a part necessary to be adhered by soldering to such a planar surface 1', heated, and adhered with the capacitor 5 to a circuit pattern by soldering.</p> |
