| 摘要 |
<p>PURPOSE:To shorten significantly the development period of a semiconductor device by a method wherein the device is provided with an auxiliary semiconductor element held by a semiconductor device and the circuit formation surface of this auxiliary semiconductor device is directly bonded on the circuit formation surface of the semiconductor device by bumps. CONSTITUTION:An auxiliary semiconductor device 9 is subjected to face down bonding on the center of a main semiconductor device 6. That is, a circuit formation surface 9a of the device 9 is bonded on a circuit formation surface 6a of the device 6 by bumps 10. In the formation surface 6a, a plurality of bonding pads 11 for lead use are formed along the outer peripheral edges of the formation surface 6a and at the same time, a plurality of pieces of bonding pads 12 for the auxiliary semiconductor device use are formed on the inside of the pads 11. The pads 11 are bonded to conductor leads 5 and the pads 12 are bonded to the device 9. In such a way, as the formation surface 9a is directly bonded on the formation surface 6a by the bumps, there is no need to redesign the board for mounting a semiconductor device and the semiconductor device and a new semiconductor function can be simply added to an existing semiconductor device.</p> |
