| 摘要 |
<p>PURPOSE:To reduce the manufacturing cost of a metal mold and the loss time of metal mold exchange by providing a resin injection hole in a device mounting part and an air vent part in the device mounting part and a suspension lead for the former. CONSTITUTION:A resin injection hole 13 and an air vent part 14 are provided in a semiconductor device mounting part 12 and in the same part 12 and a suspension lead of the former, respectively. Further, an insulating frame 15 is provided on the circumference of the device mounting part 12 so as not to block the resin injection hole 13 and the air vent part 14. A semiconductor device 16 is fixed to the device mounting frame 11 through a brazing material 17 and a lead frame 18 is fixedly mounted on the insulating frame 15 by an insulating bonding agent and the like. Thereupon, the semiconductor device 16 and the internal lead 1A are electrically connected through a bonding wire 19. Further, the frame 11 on which the semiconductor device 16 has been mounted is held between metal molds 1B and 1C, and mold resin 1D is poured into a runner 1E and a subrunner 1F through the resin injection hole 13. Hereby, manufacturing cost and exchange loss time of a metal mold can be reduced.</p> |
