发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 <p>PURPOSE:To prevent the generation fo press bonding failure by eliminating a copper foil coated part of a work substrate so that independent copper foiled parts shaped in small circle may remain with specified regularity, and using the parts subjected to elimination process as a residual gas discharge passage. CONSTITUTION:Product substrates 2a and 2b are laid out inside a work substrate 1 while small-circle residual copper foiled parts 3 are independently formed respectively on parts where the product substrates 2a and 2b are installed, are laid out in matrix or lined up linearly. During bonding contact the residual gas inside the product substrates 2a and 2b is discharged outside passing through a reticulated residual gas discharge passage 4. The pattern density of the remaining copper foiled parts 3 is constant per unit area when the gas is discharged. Therefore, the discharge amount of the residual gas passing through the residual gas discharge passage 4 is constant irrespective of the size of the product substrates. It is, therefore, possible to prevent the generation of press bonding failure.</p>
申请公布号 JPH0312996(A) 申请公布日期 1991.01.21
申请号 JP19890146619 申请日期 1989.06.12
申请人 IBIDEN CO LTD 发明人 YAMASHITA TAKAHIRO;YAMADA TAKESHI
分类号 H05K3/46 主分类号 H05K3/46
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