| 摘要 |
<p>PURPOSE:To prevent a wafer from being charged with electric charges independently of the material of a wafer carrier by providing a wafer contact part such that at least one end of the wafer in the wafer carrier makes contact with the wafer contact part upon placing the wafer carrier. CONSTITUTION:A conductive or semiconductive wafer contact part 3 is provided such that one end of a wafer 5 placed on a wafer carrier 4 makes contact with the wafer carrier 4. For this, even though the wafer carrier 4 is charged with static electricity after processing and hence static electricity is induced on the wafer 5, when the wafer carrier 4 on which the wafer 5 is placed is placed on a wafer carrier holding device 1, the static electricity on the wafer 5 can be removed through the wafer contact part by earthening the wafer 5 contact part. Hereby, the material of the wafer carrier 4 comprises an insulator material, e.g. Teflon liable to be charged, the wafer 5 can be prevented from being charged in storage thereof irrespective of the material.</p> |
