| 摘要 |
<p>PURPOSE:To eliminate the need for high positional accuracy of bare chip and improve the reliability for reflowing by connecting electrode with solder whose composition has different solid phase linear temperatures and liquid phase linear temperatures. CONSTITUTION:This invention comprises an electrode 1 installed on an insulating material 4, an electrode 2 installed on a chip component 3, the chip component, and the insulating material 4. The electrode 1 and are connected with solder 5 whose composition has different solid phase linear temperature and liquid phase linear temperatures. The solder 5 is made of alloy which contains metal particles 6 capable of forming an alloy structure with the electrodes 1 and 2. The quantities of the metal particles 6 are set so that the average composition ratio of the whole joint section including the solder 5 may have different solid phase linear temperatures and liquid phase linear temperatures and the percentage of the metal particles 6 at the solid phase temperature may exceed a specified value. This construction make it possible to produce a wider gap between the electrode 2 on the chip components 3 and the electrode 2 on the substrate 4, thereby eliminating the need for high accuracy required for determining the chip component 3. Furthermore, this construction can improve the stabilization for reflow.</p> |
