| 摘要 |
PURPOSE:To polish a substance to be polished with a thick section accurately without the occurrence of bending to a carrier and damage by a method wherein first and second grooves are formed in inner and outer rings in a manner to nip the carrier from plate surfaces on both sides. CONSTITUTION:Upper and lower surface plates 24 and 21 are functioned as a polishing board, and a carrier 13 is nipped from plate surfaces on both sides by means of the portion on the outer peripheral part of a first groove 27 of each of outer rings 22 and 25 and the portion on the inner peripheral side of a second groove 28 of each of inner rings 23 and 26. A substance 14 to be polished held by the carrier 13 in a state to block bending of the carrier 13 can be accurately polished to form a parallel plane without the occurrence of deviated wear by means of the upper and lower surface plates 24 and 21. |
