| 摘要 |
PURPOSE:To enhance electrical reliability by a method wherein a bonding pad of a semiconductor chip and an inner lead are connected electrically at a bump electrode. CONSTITUTION:A plurality of bonding pads which have been arranged in the central part on a main face of a semiconductor chip 1 and inner leads 11 are connected electrically at bump electrodes 3. A mechanical strength of the bump electrodes 3 is high as compared with that of a bonding wire; the electrodes are not moved even when they are pushed by a resin during a resin sealing process; as a result, a short circuit, a disconnection or the like is not caused. Thereby, it is possible to enhance electrical reliability of a resin-sealed type semiconductor device. |
