发明名称 PRODUCTION OF LAMINATED PLATE CLAD WITH COPPER
摘要 <p>PURPOSE:To obtain a laminated plate clad with copper which is excellent in mechanical strength an electric characteristics especially dielectric characteristics and free from brittleness by impregnating a base material made of glass fiber with epoxy resin and drying this base material to obtain a prepreg and laminating both an ultra-high mol.wt. PE sheet and a copper foil via this prepreg, heating, pressurizing and molding the laminated material. CONSTITUTION:A prepreg 2 impregnated with thermosetting resin being in the curing state of a B stage is pinched between an ultra-high mol.wt. pts.wt. PE sheet 1 which has average mol.wt. of one-four million and is mixed with a filler and a copper foil 3 and molded. Epoxy resin of a polymerization system is optimum as resin of the prepreg. Cloth and nonwoven fabric made of glass fiber are suitable as a base material. In the production of a laminated plate clad with copper, when a multi-stages press is utilized, the ultra-high mol.wt. PE sheet is cut as constant dimension. The laminated plate lined with copper is constituted of this PE sheet, the prepreg and the copper foil. 2-15 sheets are inserted into a first platen of the multi-platen pres and molded. The molding conditions are regulated to 170 deg.C, 20 bar in pressure and for 60 minutes. This laminated plate is excellent in mechanical strength, resistance to solvent, resistance to impact absorptivity and rate of change in dimension and sufficient in soldering heat resistance and has the excellent dielectric characteristics.</p>
申请公布号 JPH0310836(A) 申请公布日期 1991.01.18
申请号 JP19890146246 申请日期 1989.06.08
申请人 HITACHI CHEM CO LTD 发明人 SOTOGI TAKEYUKI;SATO YOSHINORI
分类号 B32B15/08;B32B37/10;B32B43/00;H05K1/03 主分类号 B32B15/08
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