| 摘要 |
PURPOSE:To prevent a bonding pad from being exfoliated by a method wherein a binding member whose rear surface is connected to a substrate and which is composed of a superconducting material is formed in a through hole made in an insulating film and the bonding pad which is composed of the superconducting material is connected to the surface of the binding member. CONSTITUTION:An Si wafer is used as a substrate 1; Nb or NbN is used as a material for an interconnection 4; Nb or NbN is used as a pillar-shaped binding member 5. An insulating film 2 which is situated under a bonding pad 3 and just above the substrate 1 is removed; a through hole is made. The binding member 5 is situated in the through hole; its rear surface is brought into a close contact with the substrate 1 and its surface is brought into a close contact with the bonding pad 3. Thereby, even when the insulating film is not brought into close contact with the interconnection satisfactorily, it is possible to prevent the bonding pad from being exfoliated. |
