| 摘要 |
PURPOSE:To prevent a brazing material for sealing use from flowing into the inside when a container and a cap are sealed by a method wherein the surface of a metal layer excluding a sealing part at the rear surface of the cap is covered with an oxide film. CONSTITUTION:A semiconductor element 8 is mounted inside a container 7, made of a ceramic, which is provided with a U-shaped part, the semiconductor element 8 is connected, via Au wires 9, to an outer extraction electrode 10 which has been fixed to the rear surface of the container 7. A cap used to seal the container 7 is constituted of the following: a ceramic sheet 1; a W film 2 and an Ni film 3 as a barrier film which have been installed one after another under its rear surface. An An-plated film 4 is formed only at a sealing part. The exposed surface of the Ni film 3 is covered with a nickel oxide film 11. Thereby, when the cap and the container are sealed by using an Au-Sn brazing material, it is possible to prevent the Au-Sn brazing material from flowing into the inside of a sealed part. |
