| 摘要 |
<p>PURPOSE:To improve working efficiency and stabilize bonding state by a method wherein actual bonding level is detects for each specimen, and the speed change point of tool descending is automatically changed in response to the detected value. CONSTITUTION:A tool is made to quickly descend toward the bonding surface of a specimen, and the speed is changed at a speed change point in the vicinity of the bonding surface; then the tool is made to slowly descend and pressed against the bonding surface with pressure, thereby performing bonding. In this bonding method, the bonding level wherein the tool comes into contact with the bonding surface is detected by a bonding surface detector 25 and stored; in response to the preceeding bonding level of the same specimen, the speed change point of tool descending is automatically decided by a microcomputer, and bonding is performed. That is, while the actual bonding level is detected for each specimen, the speed change point of tool descending is automatically changed in response to the detected value. Thereby the period for slow descending is not increased unnecessarily, working efficiency is improved, bonding state is stabilized, and bondability is improved.</p> |
