发明名称 COMPONENT PACKAGING INSPECTING DEVICE
摘要 PURPOSE:To improve the accuracy of packaged component inspection by correcting the position of a printed board to be inspected by inspection windows by using a normal light source, and correcting software inspection reference data and then performing the inspection. CONSTITUTION:An instruction for moving an XY table 2 is supplied to X- and Y-axial moving mechanisms 11X and 11Y through an XY table controller 10 and a 1st component to be inspected which is on the board A is set in the image pickup range of a CCD camera 3. The normal light source 17 is turned on by a shutter controller 9, a positioning mark in an inspection window is stored on an image memory 7, and the difference from the position of the positioning mark of a reference substrate which is already registered is used to generate position correction data. The inspection reference data are corrected with the generated correction data. An instruction for switching respective shutters by turns is supplied to the controller 9 to put slit light source devices 1X and 1Y in operation and slit images in an X- and a Y-axial direction which are projected on the component to be inspected are picked up by the CCD camera 3; and the data are stored on the image memory 7 and a series image recognition processes are performed. The image processing result is compared with the correction inspection reference data to inspect the package state.
申请公布号 JPH039249(A) 申请公布日期 1991.01.17
申请号 JP19890144497 申请日期 1989.06.06
申请人 SHARP CORP 发明人 KISHIMOTO MAKOTO;KAKIMORI NOBUAKI;TAKAHASHI SACHIKUNI;HARADA TOSHITA;IWATA YUTAKA
分类号 G01N21/88;G01N21/93;G01N21/956;G06T1/00;H05K13/08 主分类号 G01N21/88
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