| 摘要 |
<p>PURPOSE:To prevent the concn. of stress to a part at the time of bending deformation by forming the insertion part formed to a card base material so that the depth thereof is larger than the thickness of an IC module and sandwiching an elastic insertion member between the bottom surface of the insertion part and the IC module. CONSTITUTION:An insertion part 16 for inserting an IC module is formed to one side surface of a card base material 1a and formed into a rectangular cross-section so that the depth dimension (b) thereof up to the bottom surface part thereof is made larger than the thickness dimension (c) of the IC module 15. An elastic adhesive is fitted to the gap formed by this dimension difference to form an elastic spacer and the IC module 15 is bonded to the card base material 1a. By this structure, when an IC card 1 is curved, the part where the elastic adhesive 17 is sandwiched can be easily deformed and, therefore, the dispersion of stress can be achieved.</p> |
