发明名称 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE USED THEREFOR
摘要 <p>PURPOSE:To make it effectively cope with high speed advancement of signal propagation by forming a base, to which a lead frame is fused together by glass, out of metallic material, and connecting the base to the land line of the lead frame. CONSTITUTION:A base 10 and a window frame 12, and the window frame 12 and a lead frame 14 are fused together, respectively, by low melting point of crystallized glass 18, and the lead frame 14 and a cap 16 are fused together by low melting point of amorphous glass 20. The base 10 and the ground line of the lead frame 14 are connected by a ground connecting line 22, whereby the base 10 is maintained at earth potential. The window frame 12 and the power source line of the lead frame 14 are connected by a power source connecting line 24, whereby the window frame 12 functions as a power source line. A semiconductor chip 26 is junctioned to the base 10, and wires 28 is bonded to connect to lead frame 14 and the window frame 12 with the semiconductor chip 26. This way, high-speed signal propagation can be realized.</p>
申请公布号 JPH038362(A) 申请公布日期 1991.01.16
申请号 JP19890143510 申请日期 1989.06.06
申请人 SHINKO ELECTRIC IND CO LTD 发明人 TOKUTAKE YASUE;FUKASE KATSUYA
分类号 H01L23/06 主分类号 H01L23/06
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