| 摘要 |
PURPOSE:To prevent the oxidation of solder and lead wires by beating an inert gas in a gas chamber filled with the inert gas, bringing the inert gas into contact with a circuit board to heat the circuit board up to the soldering temp., soldering the circuit board, then bringing the cooled inert gas into contact with the circuit board and cooling the circuit board. CONSTITUTION:The inert gas is circulated from above to below a transporting device 2 for transporting the circuit board mounted with electronic parts 12 by a blown 4 disposed below the transporting device in the inert gas chamber 9 filled with the inert gas. This inert gas is admitted into a heater 3 and is thereby heated. The heated inert gas is brought into contact with the circuit board 13 and thereafter, the heated inert gas discharged from the blown 4 is circulated from below to above, by which the electronic parts 12 are soldered to the circuit board 13. The inert gas cooled in a cooler 6 is then circulated by a force feeder 8 disposed below the transporting device 2 and is brought into contact with the above-mentioned circuit board 13 to cool the circuit board 13. The soldering performance is improved in this way and the reliability of the finished circuit board is enhanced. |
