DEVICE FOR COOLING INTEGRATED CIRCUIT CHIP

摘要

Disclosed is a cooling structure cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate (30) formed with minute grooves (31) on one of its surfaces is disposed between each of the integrated circuit chip (2) and an associated cooling block (20) and is brought into contact at the grooved surface with the integrated circuit chip through a layer of a liquid (200) such as silicone oil interposed therebetween, thereby producing negative hydrostatic pressure by the capillary action of the grooves. The suction plate (30) has a thickness small enough to be bent under influence of the negative hydrostatic pressure to follow up warping of the integrated circuit chip, so that the clearance between the opposing surfaces of the suction plate and the integrated circuit chip can be minimized. An integrated circuit chip cooling device of surface-to-surface contact type operable with a low thermal resistance is provided, which can improve the maintainability and reliability without sacrificing the cooling efficiency.