发明名称 LAMINAR STRUCTURE COMPRISING ORGANIC MATERIAL AND INORGANIC MATERIAL, METHODS FOR PRODUCING IT AND ITS USE
摘要 <p>A laminar structure which exhibits a high degree of reliability with respect to prevention of cracks or separation comprises an organic substrate and an inorganic layer. The present invention provides a laminar structure on an organic substrate comprising the organic substrate comprising an organic material and a thin film adhering to the surface of the organic substrate and an element contained in the organic substrate in the vicinity of the surface which produces a metal bonding or covalent bonding with the inorganic layer. Methods for producing this laminar structure and its use in an optical disk or a wiring structure on an organic substrate or a structure suitable for increasing the reliability of a semiconductor integrated circuit device are described.</p>
申请公布号 EP0337445(A3) 申请公布日期 1991.01.16
申请号 EP19890106564 申请日期 1989.04.13
申请人 HITACHI, LTD. 发明人 TAKAHASHI, SHIGERU;FUKUDA, TAKUYA;SATOH, TOSHIYA;TANNO, SEIKICHI;OHUE, MICHIO;MOMMA, NAOHIRO;MISAWA, YUTAKA
分类号 G11B7/243;G11B7/244;G11B7/253;G11B7/2533;G11B7/254;G11B7/257;G11B7/2578;G11B7/26;H01L23/14;H01L23/498;H05K3/38;(IPC1-7):G11B7/24;C23C14/20;H01L21/84 主分类号 G11B7/243
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