| 摘要 |
PURPOSE:To improve work efficiency of bonding and to enable high quality of bonding by performing the recognition and memory works of the positions of all leads to be bonded next during wire bonding work. CONSTITUTION:Individual position coordinates of leads are sought based on the coordinate standard of a lead position at the position of a prestage 15 one pitch on this side of a bonding stage 14. That is, a lead position recognition camera 17, which is fixed to an X-Y table 16 being placed on an X-Y table 11 and performing horizontal shift different from the X-Y table 11, catches detection marks 6-1 and 6-2, being the coordinates of the leads 4, by the X-Y table 16 being operated according to the distance of the standard position of the lead 4 stored in a recognition storage device 18, and it recognizes the position coordinate of the lead 4 and stores it in the recognition storage device 18. Next, by shifting a table 10 pitch by pitch and shifting a table 11 according to the coordinate of the standard position of a pad 3 being stored, wire bonding is done by a bonding tool 12. |
