PLASTIC CHIP CARRIER PACKAGE AND METHOD OF PREPARATION

摘要

An improved integrated circuit chip package (10) is disclosed utilizing a high temperature low dielectric constant thermoplastic material which is chemically treated after molding of the thermoplastic member to improve metal adhesion. A conductive metal trace (22) is deposited on the chemically modified thermoplastic surface to enable electrical interconnection between the chip element (26) and external terminal means (20). A method to form said improved chip packge and assemble the chip element thereto is also disclosed.