| 摘要 |
The use of an amorphous polymer blended with a semicrystalline polymer to render the latter susceptible to adhesion promotion for good peel strength after electroless copper plating, while maintaining the advantages of the semicrystalline polymer including high temperature characteristics, ease of molding, and low cost is disclosed. The invention provides an injection-moldable material with the advantages of a semicrystalline thermoplastic but that can be made to accept electroless metal deposits for fabrication of electronic devices. The material is a blend including a high-temperature semicrystalline thermoplasstic polymer with an amorphous polymer that is easily etched and that is preferably compatible with the semicrystalline polymer. A preferred exemplary blend comprises poly(cyclohexylenedimethylene terephthalate) with polyethersulfone and/or polyarylate.
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